via filled by resin or by soldermask , how do we choose?
via filled by resin and via filled by soldermask,they have different Advantages and disadvantages.do via by resin or soldermarsk ,it depondes on your job.
Advantages and disadvantages of via filled by resin
Pros:
1.high plumpness and quality : Via filled with epoxy resin, the surface is ground and copper-plated to ensure that the hole is filled full, and the problem of air blowing in the air caused by the shrinkage of the ink plug hole after curing
2.high strength and protective properties : the cured resin of the resin plug hole has higher hardness and strength, which can enhance the structural strength and stability of the circuit board, reduce the penetration of chemical substances, and provide better electrical performance and reliability .
3.strong adaptability :via filled by resin is suitable for through hole jack on multi-layer board BGA, buried hole in inner HDI, and through hole with large thickness .
Cons:
higher cost : due to the complexity of the resin jack process and the need for high-quality materials, the overall cost is relatively high
Advantages and disadvantages of via filled by soldermask
Pros:
1.low cost : The process of via filled by soldermask is relatively simple, the required material cost is low, the overall cost is relatively low
2.simple and easy to operate : through screen printing ink filled into the holes, the process is relatively simple, suitable for large-scale production .
Cons:
1.low plumpness : there will be a certain shrinkage of the ink during the curing process, which may lead to insufficient filling in the hole, and it is difficult to meet the requirements of high plumpness
2.appearance general : via filled by soldermask is mainly used for ordinary through the hole, the surface is ink, will not conduct electricity, but in the appearance effect and identification than via filled by resin .
do you have your decision to choose via filled by resin or by soldermask for your job in hand?