Production and processing of SMT components such as resistors, capacitors, inductors, diodes,0402,0603, 0805, 1206 and other specifications and sizes; transistors, etc.: 03015, 01005, 0201
IC: Support SOP, TSOP, TSSOP, QFN and other packages, minimum pitch 0.3mm;Support BGA, CSP packaging, minimum ball diameter (Ball) 0.2mm;
Printing size: 50mm x 50mm ~ 370×470mm;
PCB specifications: thickness 0.4mm ~ 6mm